Ahead of IFA Berlin, Huawei just confirmed its latest in-house Kirin 990 chipset will be announced at its event on September 6. The brand released a short video which details the SoC will come with 5G capabilities and some past rumors suggest the modem will be built into the chipset.

The Kirin 990 will be produced on TSMC’s 7nm EUV process which will provide 20% greater transistor density and in turn increased power efficiency.

Other tips suggest the new silicone will allow for 4K video recording at 60fps – a first in the Kirin series. We can expect an enhanced NPU based on…

Original source: https://www.gsmarena.com/huawei_teases_kirin_990_chipset_coming_september_6-news-38842.php