Just yesterday Honor started teasing its upcoming foldable smartphone, the Honor Magic V. The company hasn’t outed any details about it, aside from letting us know that it is in fact going to be Honor’s “first foldable flagship”, and that it’s coming soon.

According to a leaked presentation slide that surfaced in China, however, we get another bit of info about Honor’s upcoming foldable – namely that it will use the Snapdragon 8 Gen 1 chipset. It will, in fact, be the first foldable device to do so, although definitely not the last – we’re expecting a lot more entries in this category in…

Original source: https://www.gsmarena.com/honor_magic_v_will_be_the_first_foldable_smartphone_with_the_snapdragon_8_gen_1-news-52422.php